Last edited by Arashizahn
Thursday, July 30, 2020 | History

3 edition of System-Level Integrated Circuit (SLIC) development for phased array antenna applications found in the catalog.

System-Level Integrated Circuit (SLIC) development for phased array antenna applications

System-Level Integrated Circuit (SLIC) development for phased array antenna applications

  • 400 Want to read
  • 5 Currently reading

Published by National Aeronautics and Space Administration, For sale by the National Technical Information Service in [Washington, DC], [Springfield, Va .
Written in English

    Subjects:
  • Phased array antennas.,
  • Integrated circuits.

  • Edition Notes

    Other titlesSystem Level Integrated Circuit (SLIC) development for phased array antenna applications.
    StatementK.A. Shalkhauser and C.A. Raquet.
    SeriesNASA technical memorandum -- 104392.
    ContributionsRaquet, Charles A., United States. National Aeronautics and Space Administration.
    The Physical Object
    FormatMicroform
    Pagination1 v.
    ID Numbers
    Open LibraryOL18034487M

    Market_Desc: Electronics Designers System Level Engineers. Special Features: This book presents modern CMOS logic circuits, fabrication, and layout in a cohesive manner that links the material together with the system-level considerations It illustrates the top-down design procedure used in modern VLSI chip design with an emphasis on variations in the HDL, logic, circuits and layout5/5(1). Most, if not all, mobile devices have an RF component and this book tells the reader how to design and integrate that component in a very practical fashion. This book has been updated to include today's integrated circuit (IC) and system-level design issues as well as keeping its classic "wire lead" material.

    Computer-Aided Design of Analog Integrated Circuits and Systems is the cutting-edge reference that will be an invaluable resource for every semiconductor circuit designer and CAD professional who hopes to break the analog design : $ System-level modeling of MEMS - microelectromechanical systems - comprises integrated approaches to simulate, understand, and optimize the performance of sensors, actuators, and microsystems, taking into account the intricacies of the interplay between mechanical and electrical properties, circuitry, packaging, and design considerations.

    Most, if not all, mobile devices have an RF component and this book tells the reader how to design and integrate that component in a very practical fashion. This book has been updated to include today's integrated circuit (IC) and system-level design issues as well as keeping its classic "wire lead" s: 1. Design considerations for system-level ESD circuit protection Introduction As technology has evolved, mobile electronic devices have also evolved to become an integral part of people’s lives and cultures. The advent of haptics for tablets and smart-phones has encouraged increasing interaction with these devices.


Share this book
You might also like
haikus of teaching

haikus of teaching

Report and recommendations of the Minnesota Interagency Exotic Species Task Force submitted to the Natural Resources Committees of the Minnesota House and Senate

Report and recommendations of the Minnesota Interagency Exotic Species Task Force submitted to the Natural Resources Committees of the Minnesota House and Senate

British Labour Party and the Indian independence movement 1917-1939

British Labour Party and the Indian independence movement 1917-1939

Soil survey of Greene County, Virginia

Soil survey of Greene County, Virginia

1995 WSU archaeological block survey of the Hanford 600 area

1995 WSU archaeological block survey of the Hanford 600 area

Status of wastewater treatment plants .1 mgd or greater in Butler, Clermont, Hamilton, and Warren Counties, Ohio

Status of wastewater treatment plants .1 mgd or greater in Butler, Clermont, Hamilton, and Warren Counties, Ohio

Your Day Will Come

Your Day Will Come

Boston Cooks

Boston Cooks

Betting it all

Betting it all

Methods for measuring populations of small, diurnal forest birds

Methods for measuring populations of small, diurnal forest birds

Someone elses skin

Someone elses skin

An ordinance for regulating the recording of deeds and other writings.

An ordinance for regulating the recording of deeds and other writings.

River War

River War

Democracy and identity

Democracy and identity

Administrative Adjudication Bureau of the New York State Department of Motor Vehicles

Administrative Adjudication Bureau of the New York State Department of Motor Vehicles

System-Level Integrated Circuit (SLIC) development for phased array antenna applications Download PDF EPUB FB2

It is an invaluable reference for anyone developing systems-on-chip (SoC) and systems-on-package (SoP), integrated with system-level ESD protection. The book focuses on both the design of semiconductor integrated circuit (IC) components with embedded, on-chip system level protection and IC-system : Vladislav Vashchenko.

As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the system to dissipate the generated heat.

Thermal effects are forcing chip designers to apply Cited by: 3. Get this from a library. Heat management in integrated circuits: on-chip and system-level monitoring and cooling.

[Seda Ogrenci-Memik] -- "As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of.

Inhe joined Valid Logic Systems, where he did hardware design, developed a schematic editor, and built an integrated circuit layout, routing, and verification system.

InValid merged with Cadence Design Systems, after which Dr. Scheffer worked on place and route, floorplanning systems, and signal integrity issues until Price: $ The book focuses on both the design of semiconductor integrated circuit (IC) components with embedded, on-chip system level protection and IC-system co-design.

The readers will be enabled to bring the system level ESD protection solutions to the level of integrated circuits, thereby reducing or completely eliminating the need for additional. These include semiconductor physics, integrated circuit processing, transistor-level design, logic-level design, system-level design, testing, etc.

Aspects of these topics are covered throughout this text, although the emphasis is on transistor-level design of digital integrated circuits and systems. architectural-and system-level design issues, and; the cost implications of 3D IC design.

Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures is intended for practitioners in the field, researchers and graduate students seeking to know more about 3D IC design.

functionality required of integrated circuit cards (ICCs) and terminals to ensure correct operation and interoperability. Additional requirements and recommendations are provided with respect to the on -line communication between ICC and issuer and the management of cryptographic keys at terminal, issuer, and payment system Size: KB.

It is an invaluable reference for anyone developing systems-on-chip (SoC) and systems-on-package (SoP), integrated with system-level ESD protection.

The book focuses on both the design of semiconductor integrated circuit (IC) components with embedded, on-chip system level protection and IC-system co-design.

This book offers the first comprehensive view on integrated circuit and system design for the Internet of Things (IoT), and in particular for the tiny nodes at its edge. The authors provide a fresh perspective on how the IoT will evolve based on recent and foreseeable trends in the semiconductor industry, highlighting the key challenges, as.

This book addresses key aspects of analog integrated circuits and systems design related to system level electrostatic discharge (ESD) protection. It is an invaluable reference for anyone developing systems-on-chip (SoC) and systems-on-package (SoP), integrated with system-level ESD protection.

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.

Contents presented in this book include fabrication techniques for 3D TSV and D TSI Brand: World Scientific Publishing Company. The book is organized in a clear progression, with the first part covering the circuit level, treating foundations of VHDL and fundamental coding, and the second part covering the system level (units that might be located in a library for code sharing, reuse, and partitioning), expanding upon the earlier chapters to discuss system coding.

Three-Dimensional Integrated Circuit Design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits.

Working from the fundamentals of transistor-level design and building up to system-level considerations, Digital Integrated Circuit Design shows students with minimal background in electronics how to design state-of-the-art high performance digital integrated circuits.4/5.

digital integrated circuit design Download digital integrated circuit design or read online books in PDF, EPUB, Tuebl, and Mobi Format. Click Download or Read Online button to get digital integrated circuit design book now.

This site is like a library, Use search box in the widget to get ebook that you want. Operational Amplifiers and Linear Integrated Circuits Theory and Application. The goal of this text, as its name implies, is to allow the reader to become proficient in the analysis and design of circuits utilizing modern linear ICs.

It progresses from the fundamental circuit building blocks through to analog/digital conversion systems. This book addresses key aspects of analog integrated circuits and systems design related to system level electrostatic discharge (ESD) protection.

It is an invaluable reference for anyone developing systems-on-chip (SoC) and systems-on-package (SoP), integrated with system-level ESD protection. The book focuses on both the design of semiconductor integrated circuit (IC) components with. Electronic system level (ESL) design and verification is an electronic design methodology, focused on higher abstraction level concerns.

The term Electronic System Level or ESL Design was first defined by Gartner Dataquest, an EDA-industry-analysis firm, on February 1, It is defined in ESL Design and Verification as: "the utilization of appropriate abstractions in order to increase. Heat Management in Integrated Circuits Heat Management in Integrated Circuits focuses on devices and materials that are intimately integrated on-chip (as opposed to in package or on-board) for the purposes of thermal monitoring and thermal management, i.e., cooling.

I am not sure if a single book can cover about Analog as well as Digital from a design perspective. If you are beginner, I would certainly recommend you to read Design of Analog CMOS Integrated Circuits: Behzad Razavi.

This book gives you all the.Additional requirements and recommendations are provided on online communication between ICC and issuer and the management of cryptographic keys at terminal, issuer and payment system level. Book 3, Application Specification, defines the terminal and integrated circuit card procedures necessary to effect a payment system transaction in an.Integrated circuit design, or IC design, is a subset of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography.

IC design can be divided into the broad categories of.